Aluminum Copper Clad Sheet for PCB Manufacturer

Basic Info.

Model NO.	AL CCL
Application	PCB
Flame Retardant Properties	V1
Processing Technology	Electrolytic Foil
Production Process	Subtractive Process
Base Material	Aluminum
Insulation Materials	Epoxy Resin
Brand	Hfi
Transport Package	Pallet
Specification	1000*1200
Trademark	no
Origin	China

Packaging & Delivery

Package Size 120.00cm * 250.00cm * 60.00cm Package Gross Weight 1000.000kg

Product Description

AL COPPER CLAD SHEET

Item	Test Method	Unit	FW806	FW808	FW810	FW815	FW820
			0.6W	0.8W	1.0W	1.5W	2.0W
Dielectric layer thickness	After slicing, measure under microscope	μm	110-130	110-130	110-130	110-130	110-130
Thermal stress	288ºC±5ºC(180s) ,	SEC	≥120	≥120	≥120	≥120	≥120
Peel Strength	IPC-TM-650-2.4.8.1	N/mm	>1.0	>1.0	>1.0	>1.0	>1.0
Leakage voltage	50mm,current≤5mA	KV	AC≥3	AC≥3	AC≥3	AC≥3	AC≥3
	50mm, current≤0.5mA	KV	DC≥4	DC≥4	DC≥5	DC≥5	DC≥5
Breakdown Voltage	IPC-TM-650-2.5.6	KV	AC≥5	AC≥5	AC≥5	AC≥5	AC≥5
TG(DSC)	IPC-TM-650-2.4.25	ºC	>130	>130	>130	>130	>130
(TMA)	IPC-TM-650-2.4.24	%(50~260ºC)	0.5	0.5	0.5	0.5	0.5
Thermal Conductivity	Thermal conductivity tester	W/(M.K)	>0.6	>0.8	>1.0	>1.3	>1.7
Thermal Resistance	Thermal conductivity tester	ºC/W	<0.8	<0.7	<0.55	<0.5	<0.4
Copper Foil	After slicing, measure under microscope	μm	15±2,18±2,22±2,25±2,33±3,35±3,70±6
Product thickness	External Micrometer	mm	(thickness)0.6-2.0 (Tolerance):≥-0.12
Aluminum Substrate	/	/	(Aluminum grade): 1060/5052
Features
1.(CCL),
Higher thermal conductivity (T.C.)than common CCL,efficiently prolong life span of
electronic products.
2.;Superior machnical properties
3.Applications:LED, LED based lightings,backlights,etc.